Wong, Chiu Soon, Bennett, N.S., Manessis, D., Danilewsky, Andreas N. and McNally, Patrick J. ORCID: 0000-0003-2798-5121
(2014)
Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages.
Microelectronic Engineering, 117
.
pp. 48-56.
ISSN 0167-9317